Etching Module

SET Etching Module

Lateral argon ionomer cleaning system to ensure that the effective area of the coating etching uniformity of ± 10%, etching rate of 250nm / h, effectively remove the surface of the substrate material micro-oxidation layer, to enhance the coating and the substrate bonding force.

MET Etching Module

Metal etching enhances the bonding of hard coatings to the substrate. The energy of metal etching is controlled by adjusting the cathode magnetic field design to ensure that the cathode operates at low current conditions. Metal etching at low current effectively reduces the risk of tool ablation.