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Alternative Au Solder Sputtering Processes and Equipment
2892Industrial control and automation, new energy vehicles, motor energy saving, solar wind power generation and other fields need various types of power devices, power device manufacturing process, the ohmic contact layer of silicon wafers, the use of high-reliability solder sputtering to replace the pure gold sputtering process can be realized by halving the cost of materials. Thermal cycle test, 1 cycle: -40°C x 30min, 125°C x 30min...
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