Array
Etching Module
3420Lateral argon ionomer cleaning system to ensure that the effective area of the coating etching uniformity of ± 10%, etching rate of 250nm / h, effectively remove the surface of the substrate material micro-oxidation layer, to enhance the coating and substrate bonding. Metal etching can enhance the bonding force between hard coating and substrate. By adjusting the cathode magnetic field design, it ensures that the cathode works under low current conditions and controls the energy of metal etching. Low current...
View Full Version