Alternative Au Solder Sputtering Processes and Equipment

Highly reliable solder sputtering (instead of Au sputtering) technology and equipment for high power devices, which can cut material costs in half.

Industrial control and automation, new energy vehicles, motor energy saving, solar wind power generation and other fields require various types of power devices, power device manufacturing process, the ohmic contact layer of the silicon wafer, the use of high-reliability solder sputtering to replace the pure gold sputtering process can be realized to halve the cost of materials.

Thermal cycle test, 1 cycle: -40°C x 30 min, 125°C x 30 min. solder sputtering still achieved the same or even better bond strength than the conventional process at the end of 1000 cycles.

Assuming a membrane material cost of 1 for the conventional process, the cost of the new Au-free process was estimated, and solder sputtering reduces the membrane material cost by about 501 TP3T compared to conventional Au sputtering.

Multi-cathode Carousel equipment can reduce the number of chambers and realize cost control.

Naxi New Energy Laboratory, provides whole plant customized vacuum coating equipment process and equipment solutions.

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